The research team led by Chen Zhi, a professor at the School of Materials Engineering at Jiaotong University, has made a major breakthrough in the research of materials for three-dimensional integrated circuits and copper wires. It can be immediately put into the semiconductor process, which not only makes electronic products "idle", but also makes products lighter and thinner. Multiplication has revolutionized the development of three-dimensional integrated circuit technology.
This unique global research has been published in the latest issue of the world's leading journal, "SCIENCE." Wu Haohua, president of Jiaotong University, said that this research is not only a breakthrough in scientific theory, but also more practical.
This major study has already applied for domestic and foreign patents. Chen Zhi estimates that the future application level is very extensive. As long as it is an electronic product, it can be used from mobile phones, computers, medical equipment to flight facilities.
If this technology is used in high-end smart phone designs, it can make the phone lighter and thinner, faster, and longer. Most importantly, the study is not just at the laboratory stage, it can be used immediately by the industry because it is compatible with existing semiconductor processes.
Chen Zhi said that the three-dimensional integrated circuit is made of copper to conduct electricity, but the arrangement of the copper metal layer is very chaotic, requires a strong current, and the conductive effect is good, but the high current is easy to cause erosion.
The research team added key additives to the plating solution to improve the conductivity and resist high current erosion. It can be used in 3D integrated circuit IC packages and microelectronic copper wires to increase the life of electronic products several times to tens of times. It can also reduce the cost of the process.
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